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HOME PRODUCTS BOARD HANDLING EQUIPMENTS BUFFERS CURING BUFFER

CURING BUFFER

This unit is used as a curing chamber in between machines, and will keep the board at a curing temperature around 50~60°C

Features

  • User friendly touch screen control panel
  • FIFO, LIFO and pass-through operating modes selectable
  • Fast, smooth and precise indexing (Freq. inverter controller)
  • Selectable system threshold
  • Smooth and parallel width adjustment (lead screw)
  • Conveyor height 950±30mm
  • SMEMA compatible
  • Industrial heater to generate a curing chamber inside of the buffer main body
  • Temperature control and monitor
  • Programmable curing time
  • Exhaust sensor

Options

  • UV light
  • Automatic width adjustment
  • Safety interlockers
  • Wider belts or chain system

 Specifications

 

Description This unit is used as a curing chamber in between machines, and will keep the board at a curing temperature around 50~60°C
Cycle Time Approx. 10 seconds
Max. PCB Capacity 25 pcs maximum
Internal belts Type Antistatic Flat Belt of 3 mm width
Indexing Pitch 10, 20mm or specify
Power Source AC 220V, 50/60Hz, 1 phase
Power Consumption 900W Max.
Air Pressure & Consume 4-6 bar, 15 l/min Max.

 

Size Model Machine Dimensions
(LxWxH) in mm
Effective PCB Size (LxW) in mm Weight (Kg)
M WHM-102SD3TM-JCOH 600x984x1600 80x50 - 330x250 380
L WHM-102SD3TL-JCOH 620X1004X1600 80X50-440X350 400
XL WHM-102SD3TXL-JCOJH 640X1204X1600 80X50-530X460 420

 

 

 

e-Flex SMT Microsystems, Co. Ltd.
Rm 1904, Tung Wah Mansion, 199-203 Henessy Road, Wan Chai, Hong Kong, P. R. China
Tel.: +852 2868 9169, Fax: + 852 2868 2769, Email: info@eflexsmt.com